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Encapsulating Compound - 4407B
Encapsulating Compound - 4407B

bFeatures excellent wetting properties and low viscosity, which means it flows quickly and freely. Has low temperature cure properties so that it may be used in almost any type of weather. Cure time is approximately 1 hour at 22C (72F) and 20 hours at -4C (20F). Usable to -18C (0F). Designed for both splice encapsulation and cable blocking. Eliminates the need to stock more than one compound. Size: 7.4 oz. or 209 gm. Part # 4407B.

This product was added to our catalog on Thursday 26 October, 2006.